Composite materials

ABSTRACT

A composite material that includes a layer of reinforcing fibres impregnated with a curable resin matrix and a plurality of electrically conductive composite particles positioned adjacent or in proximity to the reinforcing fibres. Each of the electrically conductive composite particles is composed of a conductive component and a polymeric component, wherein the polymeric component includes one or more polymers that are initially in a solid phase and are substantially insoluble in the curable resin, but is able to undergo at least partial phase transition to a fluid phase during a curing cycle of the composite material.

This application is a Continuation Application of U.S. application Ser.No. 13/862,874 filed on Apr. 15, 2013, which claims the benefit ofpriority from United Kingdom Application No. 1206885.4 filed on Apr. 19,2012, both of which are incorporated herein by reference.

BACKGROUND

In the aerospace industry, the use of composites is becoming ever moreimportant as a large number of primary and secondary structures inaircraft frames being made of composite materials. The advantages ofcomposites in aircraft designs include high strength-to-weight ratio,excellent fatigue endurance, corrosion resistance and flexibility,allowing a significant reduction in component parts and the need forfasteners and joints. However, the application of these materials tomodern aircraft's primary and secondary structures presents specialchallenges due to the dielectric nature of the resin matrix. Althoughthe use of carbon fibres as reinforcing fibres in composite materialscan deliver some degree of electrical conductivity along theirlongitudinal direction due to their graphitic nature, the dielectricproperties of the matrix resins in the composite materials reduce theoverall electrical conductivity of the composite materials andstructures. Composites with increased electrically conductivity arerequired for aircraft primary structures to satisfy stringentrequirements for lightning strike protection, potential discharge,electrical grounding and electromagnetic shielding.

The electrical conductivity of resins and composites can be improved byincorporating different conductive particles or polymers in the resinmatrix or in the interlaminar regions of the composite structures. Suchstate of the art material solutions can be used to improve thez-direction conductivity of a composite but not its mechanicalperformance. The “z-direction” refers to the direction orthogonal to theplanes on which the reinforcing fibres are arranged in a compositestructure or the axis through the thickness of the composite structure.

SUMMARY

The present disclosure relates to fibre-reinforced composite materialswhich can provide high conductivity in the thickness direction as wellas improved delamination and impact resistance properties. According toone embodiment of the present disclosure, the fiber-reinforced compositematerial includes:

i) at least one structural layer of reinforcing fibres impregnated witha curable resin matrix; and

ii) at least one electrically conductive composite particle adjacent orin proximity to the reinforcing fibres.

The electrically conductive composite particle is a micron-sizedparticle composed of at least one electrically conductive materialdispersed in a polymeric material. As such, each conductive compositeparticle has a conductive component and a polymeric component. Thepolymeric component of the electrically conductive composite particlesis initially in a solid phase and substantially insoluble in the curableresin matrix prior to curing of the resin matrix, but it is able toundergo at least partial phase transition to a fluid phase during thecure cycle of the resin matrix. The curable resin matrix of thestructural layer may be a hardenable composition in which the polymericcomponent of the conductive composite particle is at least partiallysoluble during the cure cycle of the resin matrix.

A method for fabricating a multi-layered composite structure havingconductive composite particles in the interlaminar regions is alsodisclosed.

Another aspect of the present disclosure is directed to conductivepolymeric fibres and nonwoven structures with properties similar to theconductive composite particles.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 schematically depicts an electrically conductive compositeparticle according to one embodiment of the present disclosure.

FIG. 2 illustrates an exemplary method for producing electricallyconductive composite particles.

FIG. 3A schematically illustrates a composite structure containingelectrically conductive particles in the interlaminar regions prior tocuring.

FIG. 3B schematically illustrates the composite structure depicted inFIG. 2A after curing.

FIG. 4 is a scanning electron microscope (SEM) image showingmicro-sized, conductive composite particles manufactured according toone example of the present disclosure.

FIGS. 5A and 5B are two micrographs showing cross-sectional views of acured composite structure based on the incorporation of Copper/Polyamidecomposite particles in the interlaminar region.

FIG. 6 is a micrograph showing a cross-section of a cured compositestructure based on the incorporation of conductive Copper/PES particlesin the interlaminar region.

DETAILED DESCRIPTION

“Third generation toughened composite materials” have been recentlydeveloped for primary structures in aerospace applications. The impactresistance of such materials is improved by alternating a polymericinterleaf between fibre reinforced plies. The presence of interlaminarpolymer particles, fibres or films can significantly reduce theelectrical conductivity in the “z-direction” of the fibre reinforcedcomposite material due to the dielectric nature of the materials. It istherefore necessary to improve the composite z-direction electricalconductivity in “third generation materials” to ensure acceptable levelsof potential discharge and electrical grounding to avoid potentialcatastrophic failures of composite components or accidents associatedwith fuel vapor ignition and subsequent fuel tank explosions following alightning strike event.

The electrical conductivity of resin-based composites may be improved byincorporating different conductive particles or polymers into the resinmatrix or in the interlaminar regions of multi-layered compositematerials and structures. Metallic fillers may be used at high loadings(usually greater than 50% by weight) to reduce the resin resistivity,but this approach normally results in a significant weight gain andsubstantial mechanical properties reductions. Conjugated conductivepolymers can improve resin system conductivity at relatively lowloadings but they jeopardize the thermo-mechanical performance ofstructural resin systems and prepregs for aerospace applications.Carbon-based additives such as carbon black, carbon nano-tubes, carbonnano-fibres may also be used to modify the composition of resin systemsbut they present process-ability and dispersion difficulties, therebylimiting their use in advanced composite structures.

A series of interlaminar particles having a conductive coating have beenrecently proposed as a solution to create an electrical bridge betweentwo adjacent layers. However, such conductive particles usually can onlyprovide high electrical conductivity or impact resistance properties,but not both.

The present disclosure provides a multifunctional solution that includesa composite material having one or more structural layers of reinforcingfibres impregnated with a curable resin matrix and electricallyconductive composite particles with toughening capabilities.Furthermore, when such conductive composite particles are used in theinterlaminar regions of multilayered composite structures, they arecapable of creating electrical bridges between the structural fibrelayers in the multi-layered composite structures. The solution of thepresent disclosure provides not only improvement in the z-directionconductivity of the composite structures, but also improvements in themechanical properties, such as inter-laminar fracture toughness andimpact resistance. The term “conductive composite particle” will be usedfrom here onwards to denote “electrically conductive compositeparticles”. The conductive composite particles are micron-sizedparticles composed of at least one electrically conductive materialdispersed in at least one polymeric material. As such, each electricallyconductive composite particle has an electrically conductive componentand a polymeric component.

When a plurality of composite materials are stacked in a multilayerconfiguration (i.e. a lay-up) and cured, the polymeric component of theconductive composite particles dissolves in the resin matrix of thestructural layers, thereby releasing the conductive component, which inturn creates a controlled interlaminar region and a conductive bridgebetween the fibre layers. This material solution can simultaneouslyimprove the impact resistance and delamination strength of themultilayer composite structure while spreading out or dissipatingelectric currents, such as those generated by a lightning strike, over alarger area of the composite structure, thereby reducing the likelihoodof catastrophic damages to localized portions. Furthermore theconductive composite particles can potentially be an efficient solutionto mitigate or eliminate lightning strike direct effect, and inparticular, the edge glow phenomenon in third generation compositestructures. Finally, the electrically conductive composite particles canprovide further benefits in terms of composite electromagneticperformance. Composite particles based on highly conductive and/ormagnetic fillers can be used as a flexible tool to tailor theelectromagnetic interference (EMI) shielding efficiency, permittivityand magnetic permeability properties of composite structures.

Conductive Composite Particles

FIG. 1 schematically depicts a conductive composite particle accordingto one embodiment of the present disclosure. Although FIG. 1 shows aspherical shaped particle, it should be understood that the electricallyconductive composite particles of the present disclosure are discrete,three-dimensional structures which may be of any suitable shape,including but not limited to, spherical, spheroidal, ellipsoidal, cubic,polyhedral, rod-shaped, disc-shaped, and the like. Furthermore, theparticles may have a well-defined geometry or may be irregular in shape.

The mean particle size (d50) of the conductive composite particles isless than 150 μm, preferably within the range of 10-90 μm, morepreferably within the range of 10-60 μm. The d50 represents the medianof the particle size distribution, or alternatively is the value on thedistribution such that 50% of the particles have a particle size of thisvalue or less.

The conductive component of the conductive composite particle mayinclude metallic materials, non-metallic conductive materials, andcombinations thereof, having an electrical conductivity greater than1×10³ S/m. Suitable metallic materials include any known metalsincluding, but are not limited to, silver, gold, platinum, palladium,nickel, copper, lead, tin, aluminum, titanium, alloys and mixturesthereof. Preferably, the metallic materials have an electricalconductivity greater than 1×10⁷ S/m, more preferably greater than3×10⁷S/m. Suitable non-metallic conductive materials include, but arenot limited to, carbon or graphite-based materials.

When the conductive material is metallic, the conductive component ispresent in the range from 1% to 90% by weight based on the total weightof the conductive composite particle, preferably within the range of 30%to 85% by weight, and more preferably, in the 50%-80% range. When theconductive material is non-metallic or carbon-based, the conductivecomponent is present in the range from 1% to 75% by weight based on thetotal weight of the conductive composite particle, preferably in therange from 1% to 25% by weight.

The polymeric component of the conductive composite particles mayinclude one or more polymers that are initially in a solid phase andsubstantially insoluble in a curable resin matrix (i.e., host resinmatrix) at room temperature (i.e., 20° C.-25° C.) or at conditions notsufficient for full curing of the resin matrix, but is able to undergoat least partial phase transition to a fluid phase during the curingcycle of the host resin matrix. During the curing cycle, the polymericcomponent dissolves into the resin matrix upon contact with the resinmatrix. In other words, the polymeric component is a material which hasno solubility (or negligible solubility) in the curable resin matrix atroom temperature or at conditions not sufficient for full curing of theresin matrix (e.g. during the prepreg manufacturing), while itssolubility is substantial (i.e., greater than 50% dissolves) or total(i.e., completely dissolves) during the curing cycle of the resinmatrix.

As used herein the term “cure” or “curing” refers to the hardening of aresin matrix by cross-linking of polymer chains, brought about bychemical additives, ultraviolet radiation, microwave radiation, electronbeam, gamma radiation or other suitable thermal or non-thermalradiation.

The solubility properties of the polymers for the polymeric component inthe host curable resin matrix, as discussed in this context, can bedetermined by several known methodologies including optical microscopy,spectroscopy and the like.

For one material to be soluble in another material, the difference intheir solubility parameters (Δδ) should be as small as possible. Thesolubility parameter for a polymer may be determined by a calculationbased on the group contribution method described by Van Krevelen (see D.W. Van Krevelen, Properties of Polymers, 3rd Revised Edition, ElsevierScientific Publishing, Amsterdam, 1990, Chapter 7, pp 189-224).

The solubility parameter of a polymer may also be determined using theHansen Solubility Parameters (HSP) as a way of predicting if onematerial will dissolve in another to form a solution. The Hansenparameters are based on the idea that “like dissolves like” where onemolecule is defined as being “like” another if it bonds to itself in asimilar way.

Suitable polymers for the polymeric component of the conductivecomposite particle may be selected from homopolymers or copolymers offunctionalized or un-functionalized thermoplastic resins, singly or incombination with, thermoset resins. Suitable thermoplastic materials mayinclude, by way of example, any of the following, either alone or incombination: polyurethanes, polyketones, polyamides, polyphthalamides,polystyrenes, polybutadienes, polyacrylates, acrylics,polymethacrylates, polyethersulphone (PES), polyetherethersulphone(PEES), poly sulphones, polyesters, liquid crystal polymers, polyimides,polyetherimides (PEI), polyetherketoneketones (PEKK),polyetheretherketones (PEEK), polyarylethers, polyarylsulphides,polyphenylenes, polyphenylene oxide (PPO), polyethylene oxide (PEO),polypropylene oxide. Suitable polymers may also include elastomers(including segmented elastomers) or a combination of thermoplasticpolymer and elastomeric polymer.

Preferably, the polymeric component is selected from functionalizedthermoplastic polymers which are miscible with suitable thermosettablematrixes, have a high modulus and glass transition temperature (T_(g)),and are tough. In general, thermoplastic polymers having T_(g) of atleast 150° C., preferably greater than 200° C., are suitable.

The number average molecular weight of the thermoplastic polymers may bein the range of 2000 to 60,000. Preferably, it is over 9000, for example11,000 to 25,000. The presence of these thermoplastic polymers in a hostthermoset resin increases the toughness of the cured thermoset resin byproviding zones of tough thermoplastic between cross-linked thermosetzones. The functionalized thermoplastic polymer preferably containspendant or chain-terminating functional groups that will chemicallyreact with functional groups in the thermosetting resin composition toform covalent, ionic or hydrogen bonds. Such functional groups may beobtained by a reaction of monomers or by subsequent conversion ofproduct polymer prior to or subsequent to isolation. Preferably thefunctional groups of the thermoplastic polymer are of the formula:-A-Y

Where A is a divalent hydrocarbon group, preferably aromatic, and Y aregroups providing active hydrogen, especially OH, NH₂, NHR′ or SH, whereR′ is a hydrocarbon group containing up to 8 carbon atoms, or providingother cross-linking reactivity especially epoxy, (meth)acrylate,cyanate, isocyanate, acetylene, ethylene vinyl, allyl, benzoxazine,anhydride, oxazoline, maleimide and monomers containing saturation.

The polymeric component of the conductive composite particle is adaptedto undergo complete or partial phase transition, e.g. may completelydissolve, or may partially dissolve. “Partially dissolve” means that aportion of the polymer component is dissolved into the matrix whileanother portion retains its elemental or original form. Partialdissolution may be achieved either by ensuring that procuring time andtemperature are insufficient for complete dissolution or by providingthe polymer component as a blend or co-polymer with one or moreinsoluble polymers, for example, in the form of a random orblock-copolymer, or as a blend with or a derivative of organic orinorganic compounds

In another embodiment, the polymeric component may comprise a mixture ofthermoplastic and one or more thermoset resins, and optionally one ormore curing agents and/or catalysts for the thermoset resins. Suitablethermoset materials may include, but are not limited to, epoxy resins,an addition-polymerisation resin, especially bismaleimide resins,acrylics, unsaturated polyesters, vinyl ester resins, cyanate esterresins, isocyanate modified epoxy resins, phenolic resins, benzoxazineresins, formaldehyde condensate resins (such as with urea, melamine orphenol), polyesters, acrylics, reaction products and combinationsthereof.

Methods of Making Conductive Composite Particles

The conductive composite particles of the present disclosure may bemanufactured according to a single- or multi-step process. In oneembodiment, the particles are manufactured by a two-step process, whichincludes an initial high-shear compounding step to disperse theconductive component into a polymeric material, followed by aparticle-size reduction step. An exemplary method for manufacturing theconductive composite particles is illustrated in FIG. 2. A conductivematerial 31 and a polymeric material 32 are compounded in an extruder 33to form pellets. It should be understood that the “conductive material”may include one or more conductive materials, and the “polymericmaterial” may include one or more polymers. In such embodiment, thepolymeric material and the conductive material may be fed into theextruder, either simultaneously or sequentially, to form preferably ahomogeneous physical blend of the conductive material and polymer. Thestarting polymeric material 32 being introduced into the extruder may bein an amorphous phase, or in the form of a melt.

The starting conductive material for making the particles may beselected from known metals including, but are not limited to, silver,gold, platinum, palladium, nickel, copper, lead, tin, aluminum,titanium, alloys and mixtures thereof. Furthermore, the startingconductive material may be of any suitable shape and morphology such asflakes, powders, fibres, spheres, dendrites, discs or any otherthree-dimensional shape with a micrometric or nanometric dimension,singly or in combination. Preferably, the starting conductive materialhas a high specific surface area and low apparent density. Theconductive component preferably has an apparent density (AD) of lessthan 2.0 g/cm³, and the specific surface area (SSA) is preferably higherthan 0.1 m²/g. Examples of suitable metallic materials are low density525 nickel flakes (AD=0.65 g/cm³, available from Novamet SpecialtyProducts Corp. USA), CAP 9 silver powder (SSA=3.0 m²/g, available fromJohnson Matthey, UK), FS34 silver flakes (SSA=1.2 m²/g, available fromJohnson Matthey, UK) and CH-L7 granulate copper (AD=0.6-0.7 g/cm³,SSA=0.23 m²/g, available from GGP Metalpowder AG, Germany).

The starting conductive material for making the particles may also beselected from carbon or graphite-based materials such as chopped, shortcarbon fibres, graphite flakes, graphite nano-platelets, carbon black,single-walled carbon nano-tubes (SWCNT), double-walled carbon nano-tubes(DWCNT), multi-walled carbon nano-tubes (MWCNT), carbon nano-fibres,carbon nano-spheres, carbon nano-rods, fullarenes, carbon nano-ropes,carbon nano-ribbons, carbon nano-fibrils, carbon nano-needles, carbonnano-sheets, graphenes, carbon nano-cones, carbon nano-scrolls(scroll-like shapes), as well as the corresponding boron nitrideproducts thereof, with and without a conductive coating. These “nano-”structures refer to structures having diameters or smallest dimensionsof less than 1 micron.

The starting conductive material may also be selected from coatedproducts. Coated products include core-shell structures having anorganic or inorganic core, which may be conductive or not, and one ormore conductive shells. Suitable metal-coated products include, but arenot limited to, metal-coated graphite flakes, metal coated polymers,metal coated fibres, metal coated ceramics, metal-coated glass,metal-coated hollow glass spheres, carbon-coated glass, carbon coatedpolymers, carbon-coated fibres, carbon-coated ceramics.

Examples of the non-metallic conductive materials are NC7000multi-walled carbon nano-tubes (available from Nanocyl, Belgium),micrometric 3775 graphite flakes (SSA=23.7 m²/g, available from AsburyGraphite Mills, Inc., USA), micrometric 4012 synthetic graphite flakes(SSA=1.5 m²/g, available from Asbury Graphite Mills, Inc., USA).Examples of the coated products are the nickel-coated graphite flakesfrom Novamet Specialty Products Corp., USA (AD=1.7 g/cm³-1.9 g/cm³).

The temperature within the extruder should be controlled for optimumrheology of the composition within the extruder, for the type and theamount of conductive material added. In a preferred embodiment, thetemperature profile ranges from about 90° C. to about 350° C. A variabletemperature profile may be used along the length of the extruder.Optionally, additives, diluents, dispersants, pigments or stabilizersmay be added to the polymer/conductive blend to improve the stability,process-ability and dispersion of the conductive material in thepolymeric material.

The extruder may be equipped with screws having conventional low or highshear/mixing profiles or a combination thereof, depending on the fillertype and content, and on the polymer rheological behaviour. In oneembodiment, a sequence of low shear conventional mixing screw sectionsmay be used to achieve satisfactory dispersion levels. In a preferredembodiment, the extruder is equipped with a high-shear screw profilehaving conventional mixing segments associated with chaotic mixing unitsin order to create the optimum balance between shear and pressure forcesin the barrel for optimizing the dispersion levels, and such processconditions can be achieved by the use of a Prism TS24HC extruderequipped with a 24 mm co-rotating twin screw system with an LD ratio of40 to 1. Two different feed systems with different feed screws to suitdifferent materials (conductive material or polymer pellets) may beused. A screw speed of approximately 200-300 RPM and a specifictemperature profile in the multiple heating zones may be utilized inorder to achieve a maximum torque of 60%-95% for a given blend. Itshould be understood that other methods may be used to disperse theconductive material into the polymeric material using conventionaltechniques known to a person skilled in the art such as mechanicalmixing, sonication, high-shear mixing, rotor stator mixing and sol-geltechniques.

The process for producing the composite particles may also include aparticle size reduction/micronization step. Micronization may beconducted according to conventional techniques known in the art, forinstance, rotary impact milling, rotoplex milling (i.e. grinding in aRotoplex grinder manufactured by Hosokawa Micron Co., Ltd.), rotaryclassifier milling, ball milling, ultrafine milling in a contra-rotatingpin mill (e.g. Alpine Contraplex available from Hosokawa Micron Ltd),fluidised bed opposed jet milling, spiral-flow jet milling, cryogenicmilling. In a preferred embodiment, the pellets from the extruder 33(FIG. 2) are then subjected to grinding in an Alpine cryogenic millingsystem 34 equipped with different rotating grinding media to produce apowder of micro-sized particles having a (d50) mean particle size ofless than 150 μm, or less than 60 μm in some embodiments.

Cryogenic grinding is a size reduction process in which the polymer ismade brittle and subsequently milled in a cryogen liquid (usually liquidnitrogen or liquid argon) or at a cryogenic temperature. The cryogenicgrinding method has been proven to be a cost-efficient andenergy-efficient method for producing powders with a fine and controlledparticle size distribution while reducing the risks of thermal damagecaused by the volatilization or overheating of the constituents. Aspecific sequence of steps using stud, beater, swing beater and platebeater discs is typically developed to achieve micronized particulatesexhibiting the desired average particle size distribution (d50).

Composite Materials and Structures

The conductive composite particles of the present disclosure may be usedas interlaminar particles between fibre-reinforced polymer layers, e.g.,prepreg plies. As such, the host resin system in this context is theresin matrix of the fibre-reinforced polymer layers or prepreg plies.

The host resin matrix may be a hardenable/thermosettable composition inwhich the polymeric component of the conductive composite particle is atleast partially soluble during the curing cycle, wherein the phasetransition to the fluid phase occurs by the dissolution of the polymericcomponent in the resin matrix. Initially, when the conductive compositeparticles are in contact with or dispersed in the host resin matrixduring mixing or during the prepreg manufacturing process, the compositeparticles are in a solid phase and are insoluble in the host resinmatrix. During the curing cycle of the composite material/resin matrix,the polymeric component of each composite particle substantially orcompletely dissolves in the host resin matrix, thereby releasing theconductive component as distinct, free-flowing structures in thecomposite interlaminar region. It should be understood that, in someinstances, the polymeric component may not completely dissolve aftercuring (but substantially dissolve), and hence, the conductive componentmay be attached to a small remnant of undissolved polymeric material. Insome embodiments, phase-separation between the polymeric component andthe host resin matrix occurs during the curing cycle of the host resinmatrix.

The host resin matrix (or resin system), in which the polymericcomponent of the composite particles is soluble during curing, maycontain one or more uncured thermoset resins, which include, but are notlimited to, epoxy resins, bismaleimide, vinyl ester resins, cyanateester resins, isocyanate modified epoxy resins, phenolic resins,benzoxazine, formaldehyde condensate resins (such as with urea, melamineor phenol), polyesters, acrylics, and combinations thereof. In oneembodiment, the host resin matrix is a thermoset composition in which atleast 50% of the polymeric component of the conductive compositeparticle is soluble during the curing of the resin matrix.

Suitable epoxy resins include polyglycidyl derivatives of aromaticdiamine, aromatic mono primary amines, aminophenols, polyhydric phenols,polyhydric alcohols, polycarboxylic acids. Examples of suitable epoxyresins include polyglycidyl ethers of the bisphenols such as bisphenolA, bisphenol F, bisphenol S and bisphenol K; and polyglycidyl ethers ofcresol and phenol based novolacs.

Specific examples are tetraglycidyl derivatives of4,4′-diaminodiphenylmethane (TGDDM), resorcinol diglycidyl ether,triglycidyl-p-aminophenol, triglycidyl-m-aminophenol, bromobisphenol Fdiglycidyl ether, tetraglycidyl derivatives of diaminodiphenylmethane,trihydroxyphenyl methane triglycidyl ether, polyglycidylether ofphenol-formaldehyde novolac, polyglycidylether of o-cresol novolac ortetraglycidyl ether of tetraphenylethane.

Commercially available epoxy resins suitable for use in the host resinmatrix include N,N,N′,N′-tetraglycidyl diamino diphenylmethane (e.g. MY9663, MY 720, and MY 721 from Huntsman);N,N,N′,N′-tetraglycidyl-bis(4-aminophenyl)-1,4-diiso-propylbenzene (e.g.EPON 1071 from Momentive);N,N,N′,N′-tetraclycidyl-bis(4-amino-3,5-dimethylphenyl)-1,4-diisopropylbenzene,(e.g. EPON 1072 fromMomentive); triglycidyl ethers of p-aminophenol(e.g. MY 0510 from Hunstman); triglycidyl ethers of m-aminophenol (e.g.MY 0610 from Hunstman); diglycidyl ethers of bisphenol A based materialssuch as 2,2-bis(4,4′-dihydroxy phenyl) propane (e.g. DER 661 from Dow,or EPON 828 from Momentive, and Novolac resins preferably of viscosity8-20 Pa·s at 25° C.; glycidyl ethers of phenol Novolac resins (e.g. DEN431 or DEN 438 from Dow); di-cyclopentadiene-based phenolic novolac(e.g. Tactix 556 from Huntsman); diglycidyl 1,2-phthalate (e.g. GLY CELA-100); diglycidyl derivative of dihydroxy diphenyl methane (BisphenolF) (e.g. PY 306 from Huntsman). Other epoxy resins includecycloaliphatics such as 3′,4′-epoxycyclohexyl-3,4-epoxycyclohexanecarboxylate (e.g. CY 179 from Huntsman).

Generally, the host resin matrix contains one or more thermoset resinsin combination with other additives such as curing agents, curingcatalysts, co-monomers, rheology control agents, tackifiers, inorganicor organic fillers, elastomeric toughening agents, toughening core-shellparticles, stabilizers, inhibitors, pigments, dyes, flame retardants,reactive diluents, soluble or particulate thermoplastics and otheradditives well known to those skilled in the art for modifying theproperties of the resin matrix before or after curing.

The addition of curing agent(s) and/or catalyst(s) in the host resinmatrix is optional, but the use of such may increase the cure rateand/or reduce the cure temperatures, if desired. The curing agent issuitably selected from known curing agents, for example, aromatic oraliphatic amines, or guanidine derivatives. An aromatic amine curingagent is preferred, preferably an aromatic amine having at least twoamino groups per molecule, and particularly preferable arediaminodiphenyl sulphones, for instance where the amino groups are inthe meta- or in the para-positions with respect to the sulphone group.Particular examples are 3,3′- and 4-,4′-diaminodiphenylsulphone (DDS);methylenedianiline;bis(4-amino-3,5-dimethylphenyl)-1,4-diisopropylbenzene;bis(4-aminophenyl)-1,4-diisopropylbenzene;4,4′methylenebis-(2,6-diethyl)-aniline (MDEA from Lonza);4,4′methylenebis-(3-chloro, 2,6-diethyl)-aniline (MCDEA from Lonza);4,4′methylenebis-(2,6-diisopropyl)-aniline (M-DIPA from Lonza);3,5-diethyl toluene-2,4/2,6-diamine (D-ETDA 80 from Lonza);4,4′methylenebis-(2-isopropyl-6-methyl)-aniline (M-MIPA from Lonza);4-chlorophenyl-N,N-dimethyl-urea (e.g. Monuron);3,4-dichlorophenyl-N,N-dimethyl-urea (e.g. Diuron™) and dicyanodiamide(e.g. Amicure™ CG 1200 from Pacific Anchor Chemical).

Bisphenol chain extenders, such as bisphenol-S or thiodiphenol, are alsouseful as curing agents for epoxy resins. Examples are 3,3′- and4-,4′-DDS.

Suitable curing agents also include anhydrides, particularlypolycarboxylic anhydrides, such as nadic anhydride, methylnadicanhydride, phthalic anhydride, tetrahydrophthalic anhydride,hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride,endomethylenetetrahydrophtalic anhydride, and trimellitic anhydride.

FIGS. 3A and 3B illustrate an embodiment in which the conductivecomposite particles are incorporated in a composite structure. Referringto FIG. 3A, a plurality of conductive composite particles 20 aredispersed in the interlaminar regions 21, 22 formed between curable,composite layers 23, 24, 25. Each of the composite particles 20 containsa mixture of a metallic material and a polymeric material. Each of thecomposite layers 23, 24, 25 is composed of reinforcing fibresimpregnated with a curable resin matrix (i.e., uncured or not fullycured). The resulting laminated material is then subjected curing. Uponcuring of the stack of composite layers, the polymeric component of theconductive composite particles 20 undergoes partial or complete phasetransition to a fluid phase, and dissolves completely or substantiallydissolves in the resin matrix of the composite layers 23, 24, 25,thereby releasing the metallic material into the inter-laminar region asdepicted in FIG. 3B. When the composite layers 23, 24, 25 containconductive reinforcing fibres such as carbon fibres, the releasedmetallic material forms electrically conductive bridges between layersof reinforcement fibres in the z-direction.

The “interlaminar region” refers to the region between adjacent layersof reinforcing fibres in a multi-layered composite structure. Each fibrelayer is impregnated with one or more polymeric materials. Such layermay be referred to as “fibre-reinforced polymer layer”. Thefibre-reinforced polymer layer may take the form of a prepreg. The term“prepreg” as used herein includes a sheet or layer of fibres that hasbeen impregnated with a resin matrix within at least a portion of theirvolume. The prepreg used for manufacturing aerospace structures isusually a resin-impregnated sheet of unidirectionally alignedreinforcing fibres, often referred to as “tape” or “uni-directionaltape”. The resin matrix may be present in a partially cured or uncuredstate. The prepregs may be fully impregnated prepregs or partiallyimpregnated prepregs. Typically, a prepreg is in a form that is readyfor molding and curing into the final composite part and is commonlyused in manufacturing load-bearing structural parts, such as wings,fuselages, bulkheads and control surfaces of aircrafts. Importantproperties of the cured prepregs are high strength and stiffness withreduced weight.

A plurality of prepreg plies may be laid up in a stacking sequence toform a “prepreg lay-up.” The prepreg plies within the layup may bepositioned in a selected orientation with respect to one another, e.g.0°, ±45°, 90°, etc. Prepreg lay-ups may be manufactured by techniquesthat may include, but are not limited to, hand lay-up, automated tapelayup (ATL), advanced fibre placement (AFP), and filament winding.

Suitably, curing of the composite structure or prepreg layup isgenerally carried out at elevated temperature up to 200° C., preferablyin the range of 170° C.-190° C., and with use of elevated pressure torestrain deforming effects of escaping gases, or to restrain voidformation, suitably at pressure of up to 10 bar (1 MPa), preferably inthe range of 3 bar (0.3 MPa) to 7 bar (0.7 MPa). Preferably, the curetemperature is attained by heating at up to 5° C./min, for example 2°C./min to 3° C./min and is maintained for the required period of up to 9h, preferably up to 6 h, for example 2 h to 4 h. The use of a catalystin the resin matrix may allow even lower cure temperatures. Pressure isreleased throughout, and temperature is reduced by cooling at up to 5°C./min, for example up to 3° C./min. Post-curing at temperatures in therange of 190° C. to 350° C. and atmospheric pressure may be performed,employing suitable heating rates to improve the glass transitiontemperature of the resin matrix.

For fabricating high-performance composite materials and prepregs,suitable reinforcing fibres may be characterized in general terms ashaving a tensile strength of greater than 100,000 psi and a tensilemodulus of greater than two million psi. Fibres useful for thesepurposes include carbon or graphite fibres, glass fibres and fibresformed of silicon carbide, alumina, titania, boron and the like, as wellas fibres formed from organic polymers such as for example polyolefins,poly(benzothiazole), poly(benzimidazole), polyarylates,poly(benzoxazole), aromatic polyamides, polyaryl ethers and the like,and may include mixtures having two or more such fibres. Preferably, thefibres are selected from glass fibres, carbon fibres and aromaticpolyamide fibres, such as the fibres sold by the DuPont Company underthe trade name KEVLAR. The fibres may be used in the form of cracked,selectively discontinuous and continuous tows made up of multiplefilaments, as continuous unidirectional or multidirectional tapes, or aswoven, non-crimped, nonwoven fabrics. The woven form may be selectedfrom a plain, satin, or twill weave style. The non-crimped andmulti-axial forms may have a number of plies and fibre orientations.

The conductive composite particles are present at a content of 0.1% to25% by volume based on the total resin content in the compositestructure, and preferably in the 5%-15% range. In certain embodiments,the conductive composite particles may be used in combination withnon-conductive interlaminar toughening particles. In such embodiments,the combination of conductive and nonconductive particles may be presentat a content of up to 25% by volume based on the total resin content ofthe composite material. Non-conductive interlaminar toughening particlesmay include functionalized, un-functionalized or cross-linkedelastomeric or thermoplastic particles. Suitable materials for thenon-conductive particles may be selected from the group consisting of apolyimide material (e.g. P84), an emulsified poly(phenylene oxide)material (e.g. EPPO 16), poly(phenylene oxide) material (PPO),carboxy-terminated butadiene nitrile (CTBN), polyamide (nylon),Poly(etheretherketone) (PEEK). Non-conductive thermoplastic particlesmay be cross-linked thermoplastic particles, for example, particlescomposed of cross-linked polyethersulfone (PES), crosslinkedpolyetherethersulfone (PEES), crosslinked polyetherimide (PEI),crosslinked polyphenylene oxide (PPO), or a cross-linked copolymerthereof.

Methods of Making Composite Materials and Structures

The composite materials of the present disclosure may be manufacturedusing different processes. In general, a method for incorporating theconductive composite particles in the manufacture of composite materialsmay include:

-   -   (a) dispersing at least one conductive material in a polymeric        material to form a composite blend;    -   (b) optionally heat treating the composite blend;    -   (c) forming micron-sized conductive composite particles from the        composite blend;    -   (d) optionally heat treating the micron-sized conductive        composite particles; and    -   (e) forming a stack of composite materials which incorporates        the conductive composite particles in at least one interlaminar        region between adjacent layers of reinforcing fibres, wherein        each composite material includes at least one fibre-reinforced        polymer layer, wherein fibre-reinforced polymer layer is        composed of reinforcing fibres impregnated with a curable resin        matrix.

In one embodiment, the conductive composite particles are deposited ontothe surface of a prepreg ply prior to laminating multiple prepreg pliestogether to form a laminated stack that is ready for curing. Thecomposite particles may be deposited via any conventional techniquessuch as sprinkling, electrostatic deposition, scatter coating, spraydistribution, and any other technique known by a person skilled in theart. The distributed composite particles adhere to the surface of theprepreg due to the tack of the resin. When the prepreg plies are stackedtogether to form a laminate panel, the particles remain in theinterlaminar regions of the laminate panel.

In another embodiment, specific amounts of the conductive compositeparticles are mixed with the curable/uncured resin matrix prior to theprepreg manufacturing. In such embodiment, resin films are manufacturedfirst by coating a particle-containing resin mixture onto a releasepaper. Then, the resulting resin film is laminated onto a layer offibres under the aid of heat and pressure to impregnate the fibres,thereby forming a prepreg ply with specific fibre areal weight and resincontent. During the laminating process, the conductive compositeparticles are filtered and remain external to the fibre layer due to thefact that the size of the particles is larger than the spacing betweenthe fibres. Subsequently, when two layers of prepregs containingconductive composite particles are laminated one on top of the other,the conductive composite particles are positioned in the interlaminarregion between two adjacent prepreg plies. The polymeric component ofthe conductive composite particles has negligible or no solubility undernormal prepregging conditions.

In an alternative embodiment, a curable resin composition withoutconductive composite particles is coated onto a release paper to form aresin film, which is then brought into contact with one or both opposingsurfaces of a fibre layer. The resin impregnates the fibres and leaves alittle or no resin on the external surfaces of the fibre layer.Subsequently, a second film of curable resin containing the conductivecomposite particles is brought into contact with an outer surface of theresin-impregnated fibre layer. An additional film of curable resincontaining the conductive composite particles may be brought intocontact with the opposite outer surface of the resin-impregnated fibrelayer to form a sandwich structure. As a result, a conductiveparticle-rich resin layer remains outside of the impregnated fibre layerand does not further impregnate the fibres. A plurality of suchstructures are laminated together to form a composite structure withconductive composite particles in the interlaminar regions.

In another embodiment, two films of curable resin composition withoutconductive composite particles are brought into contact with the twoopposing surfaces of a fibre layer. The resin impregnates the fibres andleaves little or no resin on the external surfaces of the fibre layer.Subsequently, two films of curable resin containing conductive compositeparticles are brought into contact with the opposing surfaces of thepre-impregnated fibres layer. A plurality of such structures arelaminated together to form a composite structure with conductivecomposite particles in the interlaminar regions. Such approach ispreferred as it tends to provide a well-ordered laminate resulted fromthe particles not disrupting the placement of the fibres.

The composite materials, structures or prepregs formed by the abovemethods may be in the form of tapes, towpregs, or webs, with continuousor chopped lengths.

ALTERNATIVE EMBODIMENTS

According to another aspect of the present disclosure, the conductiveblend of polymeric material and conductive material used to formconductive composite particles, as discussed above, may be used formanufacturing conductive polymer fibres, non-woven materials andstructures (e.g. scrim, mat, web, veil, fleece, fabric, fibre preform,and the like).

The conductive polymer fibres may be produced by techniques known in theart for manufacturing synthetic fibres. Preferably, conductive polymerfibres are obtained by continuous extrusion of the polymer/conductiveblend onto reels, followed by mechanical stretching with heating. Morepreferably, the polymer/conductive blend in a molten form, is drawn offinto an elemental shape, cooled, then subjected to a heating andmechanical stretching regime which may orient the polymer chains andrender the composite conductive element elastomeric and predisposed todissolution. Stretching may include pulling the extruded element in airfor a desired distance, e.g. 50 to 500 mm. In one embodiment, thepolymer/conductive blend, in the form of pellets or other extrudableform is fed to an extruder having a die head (or the like), which isprovided with a desired number of apertures or slots.

The fibres may be prepared as multi-filaments of up to 20 filaments,which are drawn off from the molten polymer/conductive blend, cooled andoptionally twisted as desired, and then subjected to heating andstretching.

The conductive polymer fibres may be in the form of yarns withmono-filaments of spun strands, extruded strands, cast strands,continuous strands, continuous fibres, bi- or multi-component fibres,random fibres, staple fibres, discontinuous fibres, chopped fibres,whiskers, hollow fibres and filaments, and combinations thereof. Thefibre may be both a yarn made up of multiple mono-filaments or singleand multiple mono-filaments. Moreover, the fibres may have more complexstructures such as sheath/core, side/side, cross-section with piesegments configuration or islands-in-a-sea configuration, and they maybe made of different polymers or blends thereof. The conductive polymerfibres may contain additional organic or inorganic fillers or modifiers.Preferably, the fibre or yarn comprises fibre filaments each having adiameter of no more than about 100 μm.

Conductive nonwoven materials formed from the conductive polymer fibresmay take the form of nonwoven mats, webs, fleece and veils, which may beproduced using conventional manufacturing techniques such as wet-laying,carding, air-laying, spun-bonding, melt-blowing, flash spinning,electrostatic spinning, water-jet punching and needle punchingtechniques.

In spunbonding, the pellets of conductor/polymer blend are fed in anextruder and the molten product is forced through a plurality ofspinnerets to form continuous filaments. The filaments are cooled bymeans of a stream of air in a blowing area, drawn by aerodynamic forcesand then transported to the downstream discharge channel. The filamentsare deposited onto a wire mesh conveyor as a nonwoven web of randomfibres. This web is transferred to a bonding calender where heat andpressure are applied to set the final product. After cooling, the webmay be wound.

In the meltblown process, the conductor/polymer blend in the form of amelt is extruded through a die containing several hundred smallorifices. Streams of hot air exiting from the left and right sides ofthe die rapidly attenuate the extruded polymer streams to form extremelyfine filaments. The filaments are then blown by high-velocity air onto acollector screen, thus forming a self-bonded nonwoven web.Alternatively, the extruded, continuous filaments may be chopped intopieces and then scattered onto a heated mandrel to form a nonwoven web,followed by cooling.

A nonwoven veil for use in composite materials may be produced by thenonwoven manufacturing process discussed above without the need of anytextile weaving technique. This veil may take the form of a mat or webcomposed of continuous or chopped fibres arranged randomly. Thecomposition of the fibres includes both a polymeric component and aconductive component as in the case of the conductive compositeparticles discussed above. As such, the conductive polymeric fibres haveproperties similar to those of the conductive composite particles. Thenonwoven veil is particularly suitable for interposing between, and incontacting relation to, adjacent plies of dry structural reinforcementfibres (such as carbon fibres) in a dry fibre preform that is adaptedfor liquid resin infusion, or as an interleaf between two adjacentprepreg plies during prepreg layup.

In resin infusion, a dry fibre preform (without resin) is injected witha curable, liquid resin composition. When the nonwoven veil composed ofconductive polymeric fibres are incorporated in such dry fibre preform,the polymeric component of conductive polymeric fibres in the veilmaintains its solid phase during resin infusion. Then, during the curingof the resin-infused fibre preform, the polymeric component undergoesphase transition to a fluid phase by dissolving in the resin.

When the nonwoven veil composed of conductive polymeric fibres are usedin prepregging, the polymeric component of the conductive polymericfibres in the veil maintains its solid phase during prepreg lay up, thenduring curing, undergoes phase transition to a fluid phase by dissolvingin the resin matrix of the prepreg plies, as discussed above inreference to the interlaminar conductive composite particles.

In another embodiment, the conductive polymer fibres are part of astructural fibre preform adapted for resin infusion, wherein thestructural preform is composed of reinforcing fibres combined withconductive polymer fibres. Furthermore, the structural preform may beshaped in a three-dimensional configuration in according to the shape ofthe final composite structure to be fabricated. The fibres are combinedin manner so as to provide a physical association thereof. Combining toprovide a physical association may be by methods as known in the art oftextiles, for example, by stitching, knitting, crimping, punching,weaving, braiding, overwinding, meshing, co-mingling, aligning,twisting, coiling, knotting, threading, positioning in the same layer offibres, positioned in different but adjacent layers of fibres and thelike. The conductive polymer fibres may be arranged amongst thereinforcing fibres in aligned or mis-aligned, or stitched fashion, or asa multifilament yarn composed of multiple conductive composite fibresand reinforcing fibres. Reinforcing fibres in this context are fibresmade of carbon, glass, inorganic oxide, aramides, carbide, boron,ceramic, metal, metal coated fibres or combination thereof. Thestructural fibre preform is then injected with a curable, liquid resincomposition, followed by curing to form a composite structure withconductive properties. The polymeric component of the conductive polymerfibres undergoes the same liquid phase transition during curing asdiscussed above in reference to the conductive composite particles.

Also contemplated herein are non-crimped fabrics composed of acombination of reinforcing fibres and conductive polymer fibres.“Non-crimped” refers to a fabric wherein multiple layers of fibres arelaid upon each other and transformed into a fabric by stitching or byapplication of a binder such that the fibres remain straight and withoutsubstantial crimp. The conductive polymer fibres may be present in oneor more layers of the non-crimped fabrics. Furthermore, the conductivepolymer fibres may be present non-uniformly with respect to thereinforcing fibres to locally confer properties such as z-directionconductivity and toughening. Such non-crimp fabrics may be incorporatedinto a structural fibre preform adapted for resin infusion.

Applications

The composite materials of the present invention find utility in anyfield in which it is required to impart improved conductivity to acomposite material/structure. According to one embodiment of the presentdisclosure, the z-direction conductivity of the composite materials ofthe present disclosure is at least one order of magnitude greater thanthe values measured for conventional third-generation carbon fibrereinforced materials.

The composite materials of present disclosure is applicable to themanufacture of components for transport applications (e.g. aerospace,aeronautical, nautical and land vehicles), and including, for instance,primary and secondary aircraft structures (fuselage, wings, bulkheadsetc.), space and ballistics structures. The composite materials ofpresent disclosure also find utility in building/constructionapplications. Furthermore, the composite materials, particularlyprepregs and prepreg layups, of the present disclosure are particularlysuitable for the fabrication of load-bearing or impact-resistingstructures.

EXAMPLES

The examples that follow serve to illustrate some preferred embodimentsof the present disclosure, and test results thereof, but they should notbe construed as limiting the scope the present disclosure in any way.

Measurement Methods

In the following examples, the following measurement methods were used:

Z-Direction DC Electrical Conductivity

The electrical conductivity of cured composite materials was measured bymean of a Burster-Resistomat 2316 milliohmmeter recording resistancevalues as the ratio between the applied voltage and current in a bridgemethod. Kelvin test probes were used to create a contact between twosample surfaces. All measurements were carried out in accordance withthe 4-wire measurement method at room temperature (RT) in standardhumidity conditions.

Measurements were performed on coupons extracted from defect-free panelsprepared in accordance with EN 2565 method B. Approximately 2 mm thickquasi-isotropic square samples (side length=40 mm±0.1 mm) werecharacterized.

Composite specimen surfaces were prepared by removing the top resin richlayer to expose the carbon fibres underneath ensuring a direct contactwith the electrode. Then a commercial silver paste was used to createtwo electrodes on opposite coupon surfaces. At least 5 samples permaterial and lay-up were tested.

DC electrical conductivity was calculated in [S/m] in according to thefollowing equation:

$\sigma_{v} = {\frac{1}{R} \cdot \frac{l}{S}}$where: R is the measured resistance [Ohm];

I is the sample thickness [m];

S is the sample surface area [m²]

Particle Size Distribution

Particle size distribution was measured using a Malvern Mastersizer 2000operating in the 0.02 μm to 2000 μm range.

Example 1

Preparation of Nickel-Based Conductive Composite Particles

A sufficient amount of filamentary nickel (Ni) flakes (525 Nickel Powderavailable from Novamet) to achieve a final concentration of 70% byweight was dispersed in a functionalized polyethersulphone (PES) polymervia a melt mixing process in a twin screw extruder (Sumikaexel 5003Pfrom Sumitomo). A pure sample of the same PES polymer was used as acontrol. High-shear screw profiles for optimizing the dispersion levelswere used. The profiles include conventional mixing segments associatedwith chaotic mixing units in order to create the optimum balance betweenshear and pressure forces in the barrel of the extruder. The temperatureprofile and process conditions used are reported in Table 1.

TABLE 1 Composite Nickel/PES blend dispersion conditions Screw SampleTemperature profile [° C.] speed code Zone 1 Zone 2 Zone 3 Zone 4 Zone 5Zone 6 Zone 7 Zone 8 Zone 9 [rpm] Torque % 1 180 240 280 305 305 305 305300 290 200 81

The resulting Ni/PES blend was subjected to cryogenic grinding toproduce micro-sized particles (i.e. “micro-particles”) having an averageparticle size of less than 60 μm using an Alpine cryogenic millingsystem equipped with different rotating, grinding media. Specifically,multiple passes using stud beater, swing beater and plate beaters wereneeded to achieve the target particle size distribution. FIG. 4 shows aSEM image of the micron-sized, composite Ni/PES particles produced asthe result of cryogenic grinding.

Example 2

Effect of Nickel-Based Conductive Micro-Particles on ElectricalPerformance of Composite Structures

The composite Nickel/PES micro-particles of Example 1 were dispersed viaa sprinkling process on the surface of a CYCOM®977-2-34%-194-IMS24Kunidirectional tape (unidirectional carbon fibres impregnated withepoxy-based matrix), supplied by Cytec Engineered Materials Ltd, UK. Theparticle loading was 10% by volume based on the total resin volume inthe tape. A plurality of such tapes was laid up, one on top of another,with the micro-particles positioned between adjacent tapes, to form a1.5 mm thick quasi-isotropic test panel. The panel was then curedaccording to a 2-hour cure cycle at 180° C. in an autoclave. This testpanel was labelled as “2A”.

During the curing process, the particles were positioned in theresin-rich area between adjacent carbon fibre layers, which defines theinterlaminar region. The thermoplastic component of the compositemicro-particles dissolved in the epoxy-based matrix of the tapes duringthe cure cycle, releasing the metal component (as conductive particles)in the interlaminar regions of the multi-layered panel. In such a way,localized conductive scaffolds or bridges were created between adjacentcarbon fibre layers.

For comparison purposes, a similar test panel, labelled as “Reference1”, was manufactured by the same method but the composite PES/Nickelmicro-particles were replaced with non-conductive, cross-linkedthermoplastic (TP) particles. The z-direction conductivity values forthe two test panels are shown in Table 2.

TABLE 2 Particle interleaved composites and corresponding z-directionconductivity values Non-conductive Conductive TP particles Ni/PESparticles Conductivity Panel code (V/V %) (V/V %) (S/m) REFERENCE 1 10 —0.04 2A — 10 0.61

The controlled introduction of composite Ni/PES micro-particles in theinter-laminar regions of panel 2A was determined to produce more thanone order of magnitude of improvement in the z-direction conductivity ascompared to the Reference 1 panel. It is believed that the reduction inthe composite volume resistivity is the result of the increased numberof electric bridges created through the controlled dissolution mechanismof the composite Ni/PES micro-particles.

Example 3

Effect of Conductive Interlaminar Particles Loading on MechanicalPerformance of Composite Structures

Two different loadings (10% and 20% by volume) of the same compositeNi/PES micro-particles used in Example 2 were dispersed separately onthe surface of CYCOM®977-2-34%-194-IMS24K unidirectional tape from CytecEngineered Materials, UK. Two test panels with different particleloadings were formed by laying up the tapes with micro-particlesdispersed thereon. The resulting test panels were evaluated to determinethe effect of the composite micro-particles on thermo-mechanicalproperties. The test panel containing 10% micro-particles was labelledas “3B”, and the test panel containing 20% micro-particles was labelledas “3C”. For comparison purposes, a similar test panel, which did notcontain composite Ni/PES micro-particles, was manufactured and labelledas “REFERENCE 2”.

The mechanical performance of the test panels are shown in Table 3.

TABLE 3 Particle interleaved composites and corresponding mechanicalperformance Ni/PES G_(Ic) G_(IIc) CSAI (30J) particles [J/m²] [J/m²][MPa] Dent depth Damage area Panel code content (v/v %) EN6033 EN6034EN6038 [mm] [mm²] REFERENCE 2 — 344 911 226 0.16 1853 3B 10 548 1003 2870.16 1334 3C 20 594 1041 — — —

The introduction of 10% and 20% by volume of the composite Ni/PESparticles in panels 3B and 3C, respectively, was determined to produce60% and 73% improvement, respectively, in delamination growth resistancein Mode I as compared to the REFERENCE 2 panel. A simultaneous 10%-15%increase in delamination growth resistance in Mode II values was alsoobserved. In addition, the introduction of 10% of composite Ni/PESmicro-particles resulted in a 25% increase in compression strength aftera 30J impact while significantly reducing the damaged area.

Example 4

Effect of Silver-Based Conductive Micro-Particles on ElectricalPerformance of Composite Structures

A sufficient amount of silver (Ag) powder CAPS (from Johnson Matthey,UK) was dispersed in a commercially available, functionalizedpolyethersulphone polymer (SUMIKAEXEL 5003P from Sumitomo) via a meltmixing process in a twin screw extruder to achieve a final Agconcentration of 70% by weight of the composite blend (polymericcomponent+conductive component). High-shear screw profiles were used.The temperature profile and process conditions used are shown in Table1.

The pellets produced from the extruder were subsequently ground in acryogenic grinding device to produce composite Ag/PES micro-particleswith an average particle size of less than 60 μm.

The composite micro-particles were sprinkled ontoCYCOM®977-2-34%-194-IMS5131-24K unidirectional tape surface as describedin Example 2, and a plurality of the resulting tapes were laid up toform a quasi-isotropic panel. The panel was then cured at 180° C. for 3hours in an autoclave. A particle loading of 10% by volume based on thetotal resin content in the panel was selected for this example. Theresulting panel was labelled as “4A”.

The z-direction conductivity of the 4A panel was measured according tothe method described above. Table 4 shows the comparison in z-directionconductivity between the 4A panel and the Reference 1 panel described inExample 2.

TABLE 4 Particle interleaved composites and corresponding electricalperformance Non-conductive Conductive TP particles Ag/PES particlescontent content Conductivity Sample code (vol %) (vol %) (S/m) REFERENCE1 10 — 0.04 4A — 10 0.28

The introduction of composite Ag/PES micro-particles was found toproduce more than half order of magnitude of improvement in thez-direction conductivity as compared to the REFERENCE 1 panel.

Example 5

Effect of the Polymeric Component of Conductive CompositeMicro-Particles on Electrical Performance of Composite Structures

An alternative conductive composite blend “5A” was produced bydispersing a commercially available granulate Copper (Cu) (CH-L7 fromGGP Metalpowder AG) into a commercially available, functionalizedpolyethersulfone (PES) polymer (SUMIKAEXEL 5003P from Sumitomo, UK) in atwin-screw extruder as described in Example 1. A copper concentration of65% by weight based on the overall weight of the composite blend wasobtained.

For comparison purposes, a conductive composite blend “5B” was producedby compounding an identical content (65% by weight) of the same coppermaterial in a commercially available polyamide (VESTOSINT 2159,available from Evonik, UK) using the twin screw extruder described inExample 1. The process conditions are shown in Table 5.

TABLE 5 Dispersion conditions for composite PES/copper andPolyamide/copper blends Screw Sample Temperature profile [° C.] speedcode Zone 1 Zone 2 Zone 3 Zone 4 Zone 5 Zone 6 Zone 7 Zone 8 Zone 9[rpm] Torque % 5A 200 255 310 335 360 360 365 360 350 250 95 5B 150 180230 220 220 220 215 215 210 200 50

In both cases, the pellets produced from the extruder were ground in acryogenic grinding device to produce conductive compositemicro-particles with a (d50) mean size of less than 50 μm. Themicro-particles were then dispersed onto the surface of a977-2-34%-194-IMS24K unidirectional tape at a particle loading of 10% byvolume based on the total resin content in the tape, prior to laying-up.A plurality of such tapes was laid-up in an interleaved stackingsequence to form panels as described in Example 2. The panels were thencured in an autoclave for 3 hours at 180° C.

Z-direction conductivity values were recorded as described before andthe results are shown in Table 6. The “Reference 1” panel as disclosedin Example 2 is used herein for comparison.

TABLE 6 Particle interleaved composites and corresponding electricalperformance Non-conductive Conductive Conductive TP particle Cu/PESparticle Cu/Polyamide content content particle content ConductivitySample code (vol %) (vol %) (vol %) (S/m) REFERENCE 1 10 — — 0.04 5A —10 — 0.38 5B — — 10 0.06

FIG. 5A shows a cross-section of the cured panel (5B) containingCu/Polyamide composite particles in the interlaminar region, and FIG. 5Bis an exploded view (in dark field) of a portion of the interlaminarregion. It can be seen from FIGS. 5A and 5B that the polyamide-basedparticles did not efficiently dissolve into the epoxy matrix during thecuring cycle, thus limiting the formation of electric bridges betweenlayers of carbon fibres. Therefore, the introduction of the compositeparticles in the interlaminar region of the laminated panel did notresult in any significant improvement in the z-direction conductivityover the standard non-conductive thermoplastic interleaved panel(Reference 1).

By contrast, the PES-based particles in panel 5A substantially dissolvedinto the epoxy matrix during the curing cycle, releasing the copperparticles into the interlaminar regions of composite panel. In such away, conductive scaffolds or bridges are created between adjacent carbonfibre layers. FIG. 6 shows a cross-sectional view of the cured panel 5Acontaining 10% by volume of Cu/PES composite particles. As a result ofthe controlled dissolution mechanism, Cu/PES composite particles werefound to provide about one order of magnitude of improvement in thez-direction conductivity as compared to non-conductive thermoplasticparticles.

The above results further demonstrate that the selection of appropriatepolymeric components for the conductive composite particles is criticalin achieving the above described dissolution mechanism, which in turn,provides the improvements in z-direction conductivity for the compositestructures.

Example 6

Effect of Conductive Particles: Non-Conductive Particles Ratio onElectrical Performance of Composites

Four different panels (7A-7D) were fabricated and cured as described inExample 2 using the conductive composite Cu/PES particles described inExample 5 and non-conductive thermoplastic (TP) particles at differentconductive particles: non-conductive particles ratios shown in Table 7.The z-direction conductivity of the cured panels was measured and theresults are shown in Table 7. The “Reference 1” panel as disclosed inExample 2 is used herein for comparison.

TABLE 7 Effect of different conductive:non-conductive interlaminarparticles ratios on composite electrical performance Non-conductiveConductive TP particle Cu/PES particle content content ConductivitySample code (vol %) (vol %) (S/m) REFERENCE 1 10.0 — 0.04 7A 7.5 2.50.18 7B 5.0 5.0 0.24 7C 2.5 7.5 0.31 7D 0 10 0.38

As shown in Table 7, there is a clear improvement trend in thez-direction conductivity with increasing loading of the Cu/PES compositeparticles.

Ranges disclosed herein are inclusive and independently combinable(e.g., ranges of “up to approximately 25 vol %, or, more specifically,approximately 5 vol % to approximately 20 vol %” is inclusive of theendpoints and all intermediate values of the ranges).

While various embodiments are described herein, it will be appreciatedfrom the written description that various combinations of elements,variations or improvements therein may be made by those skilled in theart, and are within the scope of the present disclosure. In addition,many modifications may be made to adapt a particular situation ormaterial to the teachings of the present disclosure without departingfrom essential scope thereof. Therefore, it is intended that theinvention not be limited to the particular embodiment disclosed as thebest mode contemplated for carrying out this invention, but that theinvention will include all embodiments falling within the scope of theappended claims.

What is claimed is:
 1. A curable composite material comprising: i) atleast one structural layer of reinforcing fibres impregnated with acurable resin matrix; and ii) at least one electrically conductivecomposite particle adjacent or in proximity to said reinforcing fibres,wherein said conductive composite particle is formed from a blend of aconductive material and a polymeric material, and the polymeric materialin the conductive composite particle comprises one or more thermoplasticpolymers that are initially in a solid phase and substantially insolublein the curable resin matrix prior to curing of the composite material,but is able to undergo at least partial phase transition to a fluidphase by dissolving in the resin matrix during a curing cycle of thecomposite material, and wherein the one or more thermoplastic polymershas/have a glass transition temperature (T_(g)) of greater than 200° C.2. The composite material of claim 1, wherein said curable resin matrixis a thermoset composition in which at least 50% of the polymericmaterial in of the conductive composite particle is soluble in the resinmatrix during curing of the composite material, and wherein the phasetransition to the fluid phase occurs by dissolution of the polymericmaterial in the resin matrix.
 3. The composite material of claim 1,wherein the conductive material in each electrically conductivecomposite particle comprises one or more conductive materials having anelectrical conductivity greater than 1×10³ S/m.
 4. The compositematerial of claim 1, wherein the conductive material in eachelectrically conductive composite particle comprises one or moreconductive materials selected from metallic materials, non-metallicconductive materials, and combinations thereof.
 5. The compositematerial of claim 1, wherein the conductive material in the electricallyconductive composite particle comprises one or more metallic materialsselected from silver, gold, platinum, palladium, nickel, copper, lead,tin, aluminum, titanium, alloys and mixtures thereof.
 6. The compositematerial of claim 1, wherein the conductive material in the electricallyconductive composite particle comprises one or more non-metallicconductive materials selected from carbon, graphene, graphite, andcombination thereof.
 7. The composite material of claim 1, wherein thepolymeric material comprises a polyethersulphone.
 8. The compositematerial of claim 1, wherein the polymeric material in the conductivecomposite particle further comprises at least one thermoset resin. 9.The composite material of claim 8, wherein the polymeric material in theconductive composite particle further comprises a curing agent or acatalyst.
 10. The composite material of claim 1, wherein the weightcontent of the conductive material in the conductive composite particlerelative to the total weight of the conductive composite particle isfrom 1% to 90%.
 11. The composite material of claim 1, wherein aplurality of electrically conductive composite particles are present ata content of 0.1% to 25% by volume based on the volume of the totalresin content in the composite material.
 12. The composite material ofclaim 1, wherein a plurality of electrically conductive compositeparticles are present, and the particles have a mean particle size ofless than 150 μm.
 13. The composite material of claim 1 furthercomprising non-conductive particles, wherein the conductive compositeparticles combined with non-conductive particles are present at acontent of up to 25% by volume based on the volume of the total resincontent in the composite material.
 14. The composite material of claim1, wherein said curable resin matrix comprises one or more thermosetresins selected from the group consisting of: epoxy resins,bismaleimide, vinyl ester resins, cyanate ester resins,isocyanate-modified epoxy resins, phenolic resins, benzoxazine,formaldehyde condensate resins, polyesters, acrylics, and combinationsthereof.
 15. The composite material of claim 1, further comprises asecond structural layer of reinforcing fibres impregnated with a curableresin matrix, wherein said at least one conductive composite particle islocated between the layers of reinforcing fibres of the first and secondstructural layers.
 16. A curable composite laminate comprising: astructural layer of reinforcing fibres impregnated with a first curableresin matrix; and a layer of a second curable resin matrix in contactwith one of two opposing surfaces of the structural layer, wherein saidsecond curable resin matrix comprises a plurality of conductivecomposite particles and said first curable resin matrix is void of anycomposite conductive particle, and wherein each conductive compositeparticle is formed from a blend of a conductive material and a polymericmaterial, and the polymeric material comprises one or more thermoplasticpolymers that are initially in a solid phase and substantially insolublein the curable resin matrix prior to curing of the composite laminate,but is able to undergo at least partial phase transition to a fluidphase by dissolving in the second resin matrix during a curing cycle ofthe composite laminate, and wherein the one or more thermoplasticpolymers has/have a glass transition temperature (T_(g)) of greater than200° C.